Last Updated： Aggregation Period:Nov 26, 2025～Dec 23, 2025
This ranking is based on the number of page views on our site.
Last Updated： Aggregation Period:Nov 26, 2025～Dec 23, 2025
This ranking is based on the number of page views on our site.
Last Updated： Aggregation Period:Nov 26, 2025～Dec 23, 2025
This ranking is based on the number of page views on our site.
1～10 item / All 10 items
Wafer cleaning equipment. Ideal for customers requiring high-spec cleanliness.
This device is optimal for customers who require high specifications of cleanliness. It is an automated device that processes each step automatically according to the set recipe parameters for five Max 8-inch wafers simultaneously. It is a dip coater-type cleaning device that reflects the dip coating technology owned by SDI. For more details, please contact us.
We propose specifications that consider cost reduction through wet etching.
We achieve low cost and high productivity unique to wet etching. We can accommodate various transport positions and methods according to your needs, and customization with additional mechanisms is also possible. 【Features】 ■ Fully automatic acid and alkaline etching (cleaning) equipment ■ Manual acid and alkaline etching (cleaning) equipment ■ RCA cleaning equipment ■ In addition to front transport type and rear upper transport type, we can also accommodate upper transport type and rear transport type according to customer needs. ■ You can choose from carrierless transport, carrier transport, carrier hanger transport, etc., according to your budget. ■ Additional handover mechanisms with front and rear devices and external communication functions are possible. ■ Automatic doors, automatic lids, automatic chemical supply, weighing, and recovery devices can be equipped. ■ It is possible to equip a concentration management mechanism for etching solutions. Please consult us regarding the target chemicals (e.g., TMAH, KOH, HF, HCL, etc.). ■ Temperature distribution measurement in the etching processing tank can be performed as a pre-shipment inspection. ■ In addition to the up-and-down oscillation mechanism, a wafer rotation mechanism can also be added. * Testing can be conducted at our Tokyo Test Center (Sumida Ward). (Online support available) * For more details, please download the catalog or feel free to contact us.
Supports multiple chambers according to production scale. Achieves uniform etching of wafers.
Automatic Acid and Alkali Cleaning Device Compatible Work Sizes: φ2 to 12 inches. Please consult us for special sizes such as square substrates. The cleaning process is achieved by directly using two types of concentrated solutions through a two-fluid mixing nozzle. By adjusting the mixing ratio, it is possible to raise the temperature to the desired level using the reaction heat. 【Other Features】 ■ Capable of manufacturing devices with brush cleaning functions ■ Capable of manufacturing photo mask cleaning devices ■ Chemical supply and recovery unit can be integrated into the main device ■ Ozone water cleaning available as an option ■ Nanobubble cleaning available as an option You can conduct tests at our Tokyo Test Center. (Online support available) *For more details, please download the PDF (catalog) or feel free to contact us.
High-quality substrates can be provided with high throughput and low cost!
- Ideal for etching and cleaning processes. - Chemical treatment is done using a spin method, and rinse drying is done using a conveyor method. - Proven track record of high throughput support with W-lane configuration. - Measures against hazardous corrosive gases during etching: ◎ Equipped with front and rear shutters and rollers in the spin chamber. - Features temperature control circulation and reuse function for chemicals, as well as concentrated/diluted separation function for wastewater. - Swing spray function during rinsing can also be installed. - Up and down air knife drying designed to prevent reattachment of rinse water splashes. *For more details, please refer to the PDF document or feel free to contact us. Wafer, batch-type cleaning equipment, coating and developing equipment, substrate cleaning equipment, spin cleaning equipment, semiconductor manufacturing equipment, semiconductors, resist stripping equipment, megasonic, cleaning equipment, resist, photoresist, photolithography process, silicon, scrub cleaning equipment, scrub cleaning, wafer stripping equipment, wafer cleaning equipment, wafer cleaning machine.
It is possible to transport, wash, and dry without touching the front and back surfaces of the work.
A single-wafer device that performs polishing slurry scrubbing with surfactants and pure water, rinsing with a megasonic spot shower, and spin drying. It allows for transport, cleaning, and drying without touching the front and back surfaces of the workpiece. Simultaneous edge scrubbing and cleaning is also performed. ■ Capable of simultaneous cleaning of both front and back sides ■ Target wafers for cleaning: silicon, quartz, oxides, compounds, etc. ■ Compatible wafer diameters: φ2” to φ8”; thickness is negotiable ■ Also compatible with transparent wafers *For more details, please contact us or download and view the catalog.
It is possible to transport, wash, and dry without touching the front and back surfaces of the workpiece.
A single-wafer device that performs polishing slurry scrubbing with surfactants and pure water, rinsing with a megasonic spot shower, and spin drying. It allows for transport, cleaning, and drying without touching the front and back surfaces of the workpiece. Simultaneous edge scrubbing and cleaning is also performed. ■ Capable of simultaneous cleaning of both front and back sides ■ Target wafers for cleaning: silicon, quartz, oxides, compounds, etc. ■ Compatible wafer diameters: φ2” to φ8”; thickness is negotiable ■ Also compatible with transparent wafers *For more details, please contact us or download the catalog for more information.
It is possible to transport, wash, and dry without touching the front and back surfaces of the workpiece.
A single-wafer device that performs polishing slurry scrubbing with surfactants and pure water, rinsing with a megasonic spot shower, and spin drying. It allows for transport, cleaning, and drying without touching the front and back surfaces of the workpiece. Simultaneously, edge scrubbing and cleaning are also performed. ■ Capable of simultaneous cleaning of both front and back sides ■ Target wafers for cleaning: silicon, quartz, oxides, compounds, etc. ■ Compatible wafer diameters: φ2” to φ8”, thickness to be discussed ■ Also compatible with transparent wafers *For more details, please contact us or download the catalog for review.
It is possible to transport, wash, and dry without touching the front and back surfaces of the work.
A single-wafer device that performs polishing slurry scrubbing with surfactants and pure water, rinsing with megasonic spot shower, and spin drying. It allows for transport, cleaning, and drying without touching the front and back surfaces of the workpiece. Simultaneous edge scrubbing and cleaning is also performed. ■ Capable of simultaneous cleaning of both front and back sides ■ Wafer types to be cleaned: Silicon, quartz, oxides, compounds, etc. ■ Compatible wafer diameters: φ2” to φ8”, thickness to be discussed ■ Also compatible with transparent wafers *For more details, please contact us or download the catalog for more information.
It is possible to transport, wash, and dry without touching the front and back surfaces of the work.
A single-wafer device that performs polishing slurry scrubbing with surfactants and pure water, rinsing with a megasonic spot shower, and spin drying. It allows for transportation, cleaning, and drying without touching the front and back surfaces of the workpiece. Simultaneous edge scrubbing and cleaning is also performed. ■ Capable of simultaneous cleaning of both sides ■ Target wafers for cleaning: silicon, quartz, oxides, compounds, etc. ■ Compatible wafer diameters: φ2” to φ8”, thickness to be discussed ■ Also compatible with transparent wafers *For more details, please contact us or download the catalog for more information.
It is possible to transport, wash, and dry without touching the front and back surfaces of the work.
A single-wafer device that performs polishing slurry cleaning with surfactants and pure water, rinsing with a megasonic spot shower, and spin drying. It allows for transport, cleaning, and drying without touching the front and back surfaces of the workpiece. Simultaneous edge scrubbing is also performed. ■ Capable of simultaneous cleaning of both sides ■ Target wafers for cleaning: silicon, quartz, oxides, compounds, etc. ■ Compatible wafer diameters: φ2” to φ8”; thickness is negotiable ■ Also compatible with transparent wafers *For more details, please contact us or download the catalog for review.
